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ISO6721FBQDRQ1 - Texas Instruments

Description: Texas Instruments 2.7-V to 26-V, high-precision current sense amplifier 5-SOT-23 -40 to 125

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ISO6721FBQDRQ1 - Texas Instruments - PCB symbol
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ISO6721FBQDRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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ISO6721FBQDRQ1 - Texas Instruments - 3D model - Small Outline Packages - D0008A
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ISO6721FBQDRQ1 Details

  • Manufacturer Part Number:

    ISO6721FBQDRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-07-26

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO REQUIRE SUPPLY FROM 2.25V TO 5.5V

  • Interface IC Type:

    INTERFACE CIRCUIT

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.895 mm

ISO6721FBQDRQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 10uF) close to the device.
  • Use a reliable communication protocol (e.g., SPI or UART) and ensure proper signal termination. Implement error-checking mechanisms, such as CRC or checksum, to detect data corruption. Use a common mode choke or ferrite bead to filter out noise.
  • The maximum cable length depends on the specific application and the type of cable used. As a general guideline, the ISO6721FBQDRQ1 supports cable lengths up to 100 meters for a single-ended interface and up to 300 meters for a differential interface.
  • Power up the device in the following sequence: VCC, VCCA, and then VREF. Power down in the reverse sequence. Ensure that the power supplies are stable and within the recommended voltage range before applying them to the device.
  • The device has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to operate in high-temperature environments.

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ISO6721FBQDRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Interface Circuit, CMOS, PDSO8