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ISO6721QDWVRQ1 - Texas Instruments

Description: Digital Isolators Automotive, general-purpose, dual-channel, 1/1 digital isolator

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ISO6721QDWVRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWV Package 8-Pin SOIC
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ISO6721QDWVRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DWV Package 8-Pin SOIC
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ISO6721QDWVRQ1 Details

  • Manufacturer Part Number:

    ISO6721QDWVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.45

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.8 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.85 mm

ISO6721QDWVRQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 10uF) close to the device.
  • Use a reliable communication protocol (e.g., SPI or UART) and ensure proper signal termination. Implement error detection and correction mechanisms, such as checksums or CRC, to ensure data integrity.
  • Power up the device in the following sequence: VCC, then VIO, and finally the input signals. Ensure that the power supplies are stable and within the recommended voltage range before applying input signals.
  • Ensure good thermal conductivity by using a heat sink or a thermal pad. Keep the device away from heat sources and ensure good airflow. Monitor the device's temperature and adjust the system design accordingly.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency sources, and ensure proper grounding and shielding of cables. Implement EMI filters and follow good PCB design practices to minimize radiation.

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ISO6721QDWVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image ISO6721QDWVQ1 Texas Instruments

Interface Circuit, CMOS, PDSO8