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ISO7730QDBQRQ1 - Texas Instruments

Description: High Speed, Robust EMC Triple-Channel Digital Isolators

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ISO7730QDBQRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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ISO7730QDBQRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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ISO7730QDBQRQ1 Details

  • Manufacturer Part Number:

    ISO7730QDBQRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.895 mm

ISO7730QDBQRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUAAC4, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To ensure reliable operation across the entire temperature range (-40°C to 125°C), it's essential to follow the recommended operating conditions, including voltage and current limits, and to implement proper thermal management, such as heat sinking and airflow, to prevent overheating.
  • The ISO7730QDBQRQ1's low power consumption (typically 1.2 mA per channel) can impact system design, particularly in battery-powered applications. Engineers should consider the overall system power budget, battery life, and power management strategies to ensure optimal performance and minimize power consumption.
  • Texas Instruments provides a range of debugging tools and resources, including the ISO7730 evaluation module, software development kits, and application notes. Engineers can also use standard debugging techniques, such as logic analyzers and oscilloscopes, to identify and resolve issues with the device.
  • The ISO7730QDBQRQ1 is designed to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI). However, engineers should still consider EMI and RFI in system design, including proper shielding, grounding, and layout techniques, to ensure reliable operation and compliance with regulatory standards.

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ISO7730QDBQRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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