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ISO7731FQDBQQ1 - Texas Instruments

Description: Digital Isolators Automotive, robust EMC, triple-channel, 2/1, reinforced digital isolator 16-SSOP -40 to 125

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ISO7731FQDBQQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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ISO7731FQDBQQ1 - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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ISO7731FQDBQQ1 Details

  • Manufacturer Part Number:

    ISO7731FQDBQQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.895 mm

ISO7731FQDBQQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUAAC4, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To ensure reliable operation across the entire operating temperature range (-40°C to 125°C), it's essential to follow the recommended operating conditions, including voltage and current limits, and to implement proper thermal management, such as heat sinking and thermal interface materials.
  • The ISO7731FQDBQQ1's low power consumption (typically 1.2 mA per channel) can impact system design, particularly in battery-powered applications. Engineers should consider the impact on power budgeting, battery life, and system-level power management strategies.
  • To minimize the impact of high-frequency noise and EMI, engineers should follow proper PCB layout and routing guidelines, use shielding and filtering techniques, and consider the use of EMI filters or common-mode chokes in the system design.
  • Using the internal oscillator can simplify system design, but may compromise on accuracy and jitter performance. Using an external clock source can provide better accuracy and jitter performance, but adds complexity and requires additional components.

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ISO7731FQDBQQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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