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ISO7731QDBQRQ1 - Texas Instruments

Description: High Speed, Robust EMC Triple-Channel Digital Isolators

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ISO7731QDBQRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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ISO7731QDBQRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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ISO7731QDBQRQ1 Details

  • Manufacturer Part Number:

    ISO7731QDBQRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.895 mm

ISO7731QDBQRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the ISO7731QDBQRQ1 evaluation module documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To ensure reliable operation across the entire temperature range (-40°C to 125°C), it's essential to follow the recommended operating conditions, including voltage and current ratings, and to implement proper thermal management, such as heat sinking and thermal interface materials.
  • The ISO7731QDBQRQ1's high-frequency operation can generate electromagnetic interference (EMI) and radio-frequency interference (RFI). To mitigate this, it's crucial to follow proper PCB design and layout guidelines, use shielding, and implement EMI filters and absorbers as needed.
  • Texas Instruments provides a range of debugging tools and resources, including the ISO7731QDBQRQ1 evaluation module, which includes a debug interface and software tools. Additionally, engineers can use oscilloscopes, logic analyzers, and other debugging tools to identify and troubleshoot issues.
  • The ISO7731QDBQRQ1's power consumption should be considered in system design, particularly in battery-powered or power-constrained applications. Engineers should ensure that the device is properly powered, and that power-saving features are implemented to minimize energy consumption.

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ISO7731QDBQRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image ISO7731DBQR Texas Instruments

DIGITAL ISOLATOR, PDSO16