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ISO7762QDWRQ1 - Texas Instruments

Description: Digital Isolator CMOS 6-CH 100Mbps Automotive 16-Pin SOIC T/R

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ISO7762QDWRQ1 - Texas Instruments - PCB symbol
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ISO7762QDWRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016B
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ISO7762QDWRQ1 - Texas Instruments - 3D model - Small Outline Packages - DW0016B
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ISO7762QDWRQ1 Details

  • Manufacturer Part Number:

    ISO7762QDWRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-12-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    6

  • Number of Functions:

    6

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

ISO7762QDWRQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a 10nF capacitor between VCC and GND, and a 1uF capacitor between VCC_ISO and GND_ISO.
  • Use a reliable communication protocol like SPI or UART, and ensure proper signal termination and routing. Use a common clock signal and ensure the microcontroller's clock frequency is within the ISO7762QDWRQ1's specified range.
  • The maximum cable length depends on the specific application and the type of cable used. As a general guideline, the ISO7762QDWRQ1 can support cable lengths up to 10 meters at 100 Mbps. However, it's recommended to consult the datasheet and application notes for specific guidance.
  • Use proper shielding, grounding, and filtering techniques to minimize EMI. Ensure the PCB layout is designed to reduce radiation and susceptibility. Follow the guidelines in the datasheet and application notes for EMI and EMC compliance.
  • The ISO7762QDWRQ1 has a maximum junction temperature of 150°C. Ensure proper heat dissipation by using a heat sink or thermal pad, and follow the recommended PCB layout and thermal design guidelines in the datasheet and application notes.

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ISO7762QDWRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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