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ISP75DP06LMXTSA1 - Infineon

Description: MOSFET SMALL SIGNAL MOSFETS

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PCB Footprints
ISP75DP06LMXTSA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - PG-SOT223-4---
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3D Models
ISP75DP06LMXTSA1 - Infineon  - 3D model - SOT223 (3-Pin) - PG-SOT223-4---
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ISP75DP06LMXTSA1 Details

  • Manufacturer Part Number:

    ISP75DP06LMXTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-223, 4 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    TR, 7 INCH: 1000

  • Avalanche Energy Rating (Eas):

    36 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    1 A

  • Drain-source On Resistance-Max:

    0.75 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    4.2 W

  • Pulsed Drain Current-Max (IDM):

    4.4 A

  • Reference Standard:

    IEC-61249-2-21

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

ISP75DP06LMXTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Additionally, consider using a heat sink with a thermal resistance of less than 10 K/W.
  • The maximum allowed voltage on the VCC pin is 3.6 V. Exceeding this voltage may damage the device.
  • Infineon recommends using a human body model (HBM) ESD protection circuit with a minimum of 2 kV rating. Additionally, follow proper handling and storage procedures to prevent ESD damage.
  • The recommended operating frequency range for ISP75DP06LMXTSA1 is 100 kHz to 100 MHz. Operating outside this range may affect device performance and reliability.

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ISP75DP06LMXTSA1 Overview

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