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ISP762T - Infineon

Description: High Side Switch

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PCB Footprints
ISP762T - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8 (PG-DSO-8-16)
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3D Models
ISP762T - Infineon  - 3D model - Small Outline Packages - PG-DSO-8 (PG-DSO-8-16)
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ISP762T Details

  • Manufacturer Part Number:

    ISP762T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    DSO-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    8.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    34 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    20 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    230 µs

  • Turn-on Time:

    170 µs

  • Width:

    4 mm

ISP762T Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Also, ensure proper PCB design and layout to minimize thermal resistance.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, placed as close to the VIN pin as possible, to filter input voltage noise and ensure stable operation.
  • Use a logic analyzer or oscilloscope to monitor the EN, FLT, and PG pins. Check for proper power sequencing, input voltage, and output current. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • Yes, the ISP762T is designed for high-reliability applications. However, ensure that your design meets the required safety standards and guidelines, such as IEC 61508 or ISO 26262, and consult with Infineon's technical support for specific guidance.

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ISP762T Overview

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