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ISS17EP06LMXTSA1 - Infineon

Description: MOSFET SMALL SIGNAL MOSFETS

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PCB Footprints
ISS17EP06LMXTSA1 - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - PG-SOT23-3-15
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3D Models
ISS17EP06LMXTSA1 - Infineon  - 3D model - SOT23 (3-Pin) - PG-SOT23-3-15
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ISS17EP06LMXTSA1 Details

  • Manufacturer Part Number:

    ISS17EP06LMXTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-23, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.95

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    TR, 7 INCH : 3000

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.29 A

  • Drain-source On Resistance-Max:

    1.7 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    3 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    0.36 W

  • Power Dissipation-Max (Abs):

    0.36 W

  • Reference Standard:

    IEC-61249-2-21

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

ISS17EP06LMXTSA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • To prevent ESD damage, handle the device in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and avoid touching the device's pins or leads. Use an anti-static bag or wrap the device in anti-static material during storage and transportation.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and feedback resistors. Verify that the device is properly configured and that the output voltage is within the specified range. Use an oscilloscope to measure the output voltage and check for any signs of oscillation or instability.
  • When using the device in a high-reliability or safety-critical application, consider the device's failure modes, fault tolerance, and redundancy. Implement multiple layers of protection, such as overvoltage protection, undervoltage protection, and overcurrent protection. Ensure that the device is properly derated and that the system is designed to meet the required safety and reliability standards.

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ISS17EP06LMXTSA1 Overview

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