Schaffner recommends a symmetrical PCB layout with a solid ground plane and a minimum of 1 oz copper thickness to ensure optimal performance and minimize electromagnetic interference (EMI).
Schaffner recommends mounting the IT239 on a heat sink with a thermal conductivity of at least 1 W/mK and ensuring good airflow around the component to prevent overheating.
The maximum allowed voltage drop across the IT239 is 1.5 V, exceeding which may affect the component's performance and lifespan.
Yes, the IT239 can be used in a redundant or parallel configuration, but it's essential to ensure proper synchronization and phase matching to avoid any potential issues.
Schaffner recommends checking the component's thermal management, ensuring proper PCB layout, and verifying the input voltage and current ratings. If issues persist, contact Schaffner's technical support for further assistance.
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IT239 Overview
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