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ITA10B1 - STMicroelectronics

Description: 19V Clamp 25A (8/20µs) Ipp Tvs Diode Bidirectional Surface Mount 8-SOIC 570pF @ 1MHz

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ITA10B1 - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO 8_2025-1.5
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ITA10B1 - STMicroelectronics  - 3D model - Small Outline Packages - SO 8_2025-1.5
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ITA10B1 Details

  • Manufacturer Part Number:

    ITA10B1

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOD

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    10 V

  • Clamping Voltage-Max:

    19 V

  • Configuration:

    COMMON CATHODE, 6 ELEMENTS, 6 CHANNEL

  • Diode Capacitance-Min:

    570 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    6

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2; MIL-STD-883G

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    4 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

ITA10B1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure proper thermal management, use a heat sink if necessary, and follow the recommended PCB layout guidelines. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The maximum allowed voltage on the input pins is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation and prevent damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines, and follow proper PCB design guidelines for ESD protection. Also, handle the device with an anti-static wrist strap or mat to prevent ESD damage during assembly.
  • Power up the device in the following sequence: VCC, then VIN, and finally the input signals. This ensures proper device initialization and prevents latch-up or damage.

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ITA10B1 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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