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ITA25B1RL - STMicroelectronics

Description: STMicroelectronics ITA25B1RL Hex Bi-Directional TVS Diode, 300W peak, 8-Pin SOIC

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ITA25B1RL - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-08
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ITA25B1RL - STMicroelectronics  - 3D model - Small Outline Packages - SO-08
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ITA25B1RL Details

  • Manufacturer Part Number:

    ITA25B1RL

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOD

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    25 V

  • Clamping Voltage-Max:

    38 V

  • Configuration:

    COMMON CATHODE, 6 ELEMENTS, 6 CHANNEL

  • Diode Capacitance-Min:

    300 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    6

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2; MIL-STD-883G

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Reverse Current-Max:

    4 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

ITA25B1RL Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power dissipation according to the datasheet.
  • Use a soldering temperature of 260°C (500°F) for 10 seconds or less, and ensure the component is not exposed to temperatures above 300°C (572°F) during reflow soldering.
  • Yes, but ensure the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage from vibration.
  • Use ESD-protective packaging, handle the component by the body or pins, and ensure the PCB has ESD-protection components, such as TVS diodes or ESD-protection arrays.

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ITA25B1RL Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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