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ITA6V1U1RL - STMicroelectronics

Description: 12V Clamp 25A (8/20µs) Ipp Tvs Diode Surface Mount 8-SOIC

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ITA6V1U1RL - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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ITA6V1U1RL Details

  • Manufacturer Part Number:

    ITA6V1U1RL

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOD

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    6.51 V

  • Clamping Voltage-Max:

    12 V

  • Configuration:

    COMMON ANODE, 6 ELEMENTS, 6 CHANNEL

  • Diode Capacitance-Min:

    1500 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    6

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2; MIL-STD-883G

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ITA6V1U1RL Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Implement a proper thermal management system, such as a heat sink or thermal interface material, and ensure good airflow. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering and use a solder with a melting point above 217°C (423°F).
  • Ensure that the input voltage (VIN) is applied before the enable signal (EN). Use a power sequencing controller or a dedicated power management IC to manage the power-up sequence.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output lines. Implement a robust PCB design with a solid ground plane and minimize the distance between the device and the ESD protection components.

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ITA6V1U1RL Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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