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ITA6V5B1 - STMicroelectronics

Description: 12V Clamp 25A (8/20µs) Ipp Tvs Diode Surface Mount 8-SOIC , 300W , 750pF @ 1MHz, -55C ~ +125C

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ITA6V5B1 - STMicroelectronics - PCB symbol
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PCB Footprints
ITA6V5B1 - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-8_2025-2.1
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ITA6V5B1 - STMicroelectronics - 3D model - Small Outline Packages - SO-8_2025-2.1
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ITA6V5B1 Details

  • Manufacturer Part Number:

    ITA6V5B1

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOD

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    6.5 V

  • Clamping Voltage-Max:

    12 V

  • Configuration:

    COMMON CATHODE, 6 ELEMENTS, 6 CHANNEL

  • Diode Capacitance-Min:

    750 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    6

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2; MIL-STD-883G

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

ITA6V5B1 Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using a heat sink or thermal interface material to reduce the thermal resistance between the device and the heat sink.
  • Monitor the device's junction temperature (Tj), input voltage (Vin), output voltage (Vout), and output current (Iout) to ensure reliable operation. Also, keep an eye on the device's power dissipation (PD) and thermal resistance (RthJA) to prevent overheating.
  • The ITA6V5B1 has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) features. However, it's still essential to implement external protection circuits to handle voltage transients and spikes. Consider using a voltage supervisor or a dedicated overvoltage protection IC to ensure the device's reliability.
  • STMicroelectronics recommends using a low-ESR ceramic capacitor with a value between 4.7uF and 10uF as the input capacitor. The capacitor should be placed as close as possible to the device's input pins to minimize noise and ripple.

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ITA6V5B1 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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