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ITS4200SSJDXUMA1 - Infineon

Description: Power Switch ICs - Power Distribution

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ITS4200SSJDXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8_
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ITS4200SSJDXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-8_
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ITS4200SSJDXUMA1 Details

  • Manufacturer Part Number:

    ITS4200SSJDXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DSO-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.98

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    2 mA

  • Supply Voltage-Max (Vsup):

    52 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Supply Voltage-Nom (Vsup):

    13.5 V

  • Surface Mount:

    YES

  • Technology:

    NMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    4 mm

ITS4200SSJDXUMA1 Frequently Asked Questions (FAQs)

  • A symmetrical, star-shaped layout with a central thermal pad connected to a large copper area on the PCB is recommended for optimal thermal performance.
  • Calibration involves a 2-point or 3-point calibration process using a precision temperature reference and a calibration algorithm provided by Infineon or a third-party calibration service.
  • The maximum allowed thermal resistance is dependent on the application, but a general guideline is to keep it below 10 K/W to ensure accurate temperature measurements.
  • Yes, the sensor is designed to withstand high vibrations, but it's essential to ensure proper PCB mounting and a secure connection to the PCB to prevent mechanical stress.
  • Use proper PCB design techniques, such as grounding, shielding, and filtering, to minimize EMI effects. Additionally, consider using a common-mode choke or a ferrite bead to filter out high-frequency noise.

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ITS4200SSJDXUMA1 Overview

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