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ITS711L1 - Infineon

Description: Smart High-Side Power Switch 4-ch DSO-20 Infineon ITS711L1, Quad Intelligent Power Switch, High Side, 4.4A, 5 → 34V, 20-Pin, SOIC

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PCB Footprints
ITS711L1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-20-31
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3D Models
ITS711L1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-20-31
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ITS711L1 Details

  • Manufacturer Part Number:

    ITS711L1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, GREEN, DSO-20

  • Pin Count:

    20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    9

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    4

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    34 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    400 µs

  • Turn-on Time:

    400 µs

  • Width:

    7.6 mm

ITS711L1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to ensure good heat dissipation.
  • The ITS711L1 requires a stable voltage supply of 3.3V or 5V, and a bias current of 10mA to 50mA. A decoupling capacitor of 100nF to 1uF should be placed close to the device to filter out noise.
  • The ITS711L1 is rated for operation from -40°C to 125°C, but the maximum junction temperature should not exceed 150°C to ensure reliability and prevent thermal damage.
  • Handle the device by the body or use an ESD wrist strap to prevent static electricity. Use an ESD-protected workstation and follow proper handling procedures to prevent damage.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds is recommended. Avoid exceeding 280°C to prevent damage to the device.

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ITS711L1 Overview

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