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ITZ0924S3V3 - XP POWER

Description: Isolated DC/DC Converters XP POWER, 9W DC-DC, 4:1, SIP

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PCB Footprints
ITZ0924S3V3 - XP POWER PCB footprint - Other - Other - ITZ0924S24-2
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3D Models
ITZ0924S3V3 - XP POWER  - 3D model - Other - ITZ0924S24-2
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ITZ0924S3V3 Details

  • Manufacturer Part Number:

    ITZ0924S3V3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SIP-8/6

  • ECCN Code:

    EAR99

  • Manufacturer:

    XP Power

  • YTEOL:

    6

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    CE, UKCA, UL

  • Efficiency (Main Output):

    82%

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    8 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-XSIP-T6

  • Length:

    21.85 mm

  • Line Regulation-Max:

    0.2%

  • Load Regulation-Max:

    0.5%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    3.333 V

  • Output Voltage-Min:

    3.267 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SIP

  • Package Equivalence Code:

    SIP6/8,.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Protections:

    OVER LOAD; OVER VOLTAGE; SHORT CIRCUIT

  • Ripple Voltage (Main Out):

    0.02651 Vrms

  • Screening Level:

    UL 62328-1

  • Seated Height-Max:

    11.2 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    9 W

  • Trim/Adjustable Output:

    NO

  • Width:

    9.6 mm

ITZ0924S3V3 Frequently Asked Questions (FAQs)

  • XP Power recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
  • Yes, the ITZ0924S3V3 is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in industrial and transportation applications. However, it's essential to ensure proper mounting and screw torque to prevent damage.
  • To ensure EMC, XP Power recommends using a metal enclosure, keeping the module at least 1 cm away from other components, and using a common-mode choke or ferrite bead on the input lines. Additionally, follow the recommended PCB layout and grounding scheme.
  • The maximum allowable input capacitance for the ITZ0924S3V3 is 47 μF. Exceeding this value may cause instability or affect the module's performance.
  • Yes, the ITZ0924S3V3 can be used in a redundant or parallel configuration to achieve higher power or redundancy. However, it's essential to follow XP Power's guidelines for parallel operation and ensure proper synchronization and current sharing.

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ITZ0924S3V3 Overview

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