IX4426MTR footprint, schematic symbol and 3D model by LITTELFUSE

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IX4426MTR Details

The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 20mm x 20mm, and ensuring that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's current rating according to the temperature derating curve provided in the datasheet, and to ensure good airflow around the device to prevent thermal buildup.
The recommended soldering profile for the IX4426MTR involves a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C, and a ramp-up rate of 3°C/second maximum.
Yes, the IX4426MTR is designed to withstand high-vibration environments, but it is recommended to follow proper PCB mounting and screwing procedures to ensure the device remains securely attached to the PCB.
To troubleshoot issues with the device's overcurrent protection feature, check the input voltage, output current, and sense resistor values to ensure they are within the recommended specifications, and verify that the device is properly configured and connected.

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