IX4428MTR footprint, schematic symbol and 3D model by LITTELFUSE

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IX4428MTR Details

The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 20mm x 20mm, and ensuring good thermal conductivity between the pad and the surrounding copper area. Additionally, it is recommended to use a minimum of 2oz copper thickness and to avoid placing any thermal vias under the device.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's current rating according to the temperature derating curve provided in the datasheet. Additionally, it is important to ensure good airflow around the device and to avoid any thermal hotspots on the PCB.
The recommended soldering profile for the IX4428MTR involves a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It is also recommended to use a solder with a melting point of 217°C or higher.
To troubleshoot issues with the device's overcurrent protection feature, it is recommended to check the device's output current and voltage using an oscilloscope or a multimeter. Additionally, it is important to verify that the device is properly configured and that the input voltage and current are within the recommended operating range.
The recommended input capacitor value and type for the IX4428MTR depend on the specific application and operating conditions. However, as a general guideline, a ceramic capacitor with a value of 10uF to 22uF and a voltage rating of 50V or higher is recommended.

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