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IXBK55N300 - LITTELFUSE

Description: IGBT Transistors

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PCB Footprints
IXBK55N300 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IXBK55N300
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3D Models
IXBK55N300 - LITTELFUSE  - 3D model - Transistor Outline, Vertical - IXBK55N300
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IXBK55N300 Details

  • Manufacturer Part Number:

    IXBK55N300

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    LOW CONDUCTION LOSS

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    130 A

  • Collector-Emitter Voltage-Max:

    3000 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    5 V

  • Gate-Emitter Voltage-Max:

    25 V

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    625 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    475 ns

  • Turn-on Time-Nom (ton):

    637 ns

  • VCEsat-Max:

    3.2 V

IXBK55N300 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXBK55N300 is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's current rating by 1.5% per degree Celsius above 25°C, and to ensure good thermal conduction to a heat sink or thermal interface material.
  • The maximum allowed voltage transient for the IXBK55N300 is 400V, with a maximum duration of 10ms. Exceeding this limit may damage the device.
  • Yes, the IXBK55N300 can be used in parallel to increase current handling, but it is recommended to ensure that the devices are matched in terms of voltage drop and current handling to prevent uneven current sharing.
  • The recommended wire bonding method for the IXBK55N300 is ultrasonic wedge bonding using a 0.5mm diameter aluminum wire, with a minimum bond strength of 10gf.

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IXBK55N300 Overview

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