The recommended PCB footprint for the IXBK55N300 is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's current rating by 1.5% per degree Celsius above 25°C, and to ensure good thermal conduction to a heat sink or thermal interface material.
The maximum allowed voltage transient for the IXBK55N300 is 400V, with a maximum duration of 10ms. Exceeding this limit may damage the device.
Yes, the IXBK55N300 can be used in parallel to increase current handling, but it is recommended to ensure that the devices are matched in terms of voltage drop and current handling to prevent uneven current sharing.
The recommended wire bonding method for the IXBK55N300 is ultrasonic wedge bonding using a 0.5mm diameter aluminum wire, with a minimum bond strength of 10gf.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
IXBK55N300 Overview
Use the download button to access the IXBK55N300 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IXBK5,
or try a keyword search, such as IGBTs