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IXDD604SIA - LITTELFUSE

Description: Gate Drivers 4A Dual Low-Side Ultrafast Mosfet DRV

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Symbol
IXDD604SIA - LITTELFUSE - PCB symbol
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PCB Footprints
IXDD604SIA - LITTELFUSE PCB footprint - Other - Other - 8-Pin SOIC (N-PACKAGE)
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3D Models
IXDD604SIA - LITTELFUSE - 3D model - Other - 8-Pin SOIC (N-PACKAGE)
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IXDD604SIA Details

  • Manufacturer Part Number:

    IXDD604SIA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.065 µs

  • Turn-on Time:

    0.065 µs

  • Width:

    3.9 mm

IXDD604SIA Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal or bottom-side copper plane.
  • Ensure proper heat sinking, use a thermally conductive interface material, and consider derating the device's current rating based on the ambient temperature.
  • The device can withstand voltage transients up to 40V for a duration of 100ms, but it's recommended to use a TVS diode or other protection device to limit voltage spikes.
  • Yes, but be aware that the device's parasitic inductance and capacitance may affect high-frequency performance. Use a suitable PCB layout and consider adding decoupling capacitors to minimize ringing and oscillations.
  • The optimal gate resistor value depends on the specific application's switching frequency, voltage, and current. A general starting point is 10-20 ohms, but simulation and experimentation may be necessary to find the optimal value.

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IXDD604SIA Overview

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