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IXDD609SI - LITTELFUSE

Description: Gate Drivers 9-Ampere Low-Side Ultrafast MOSFET

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Symbol
IXDD609SI - LITTELFUSE - PCB symbol
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PCB Footprints
IXDD609SI - LITTELFUSE PCB footprint - Small Outline Packages - Small Outline Packages - 5.5.2 SI (8-Pin Power SOIC with Exposed Metal Back)
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3D Models
IXDD609SI - LITTELFUSE - 3D model - Small Outline Packages - 5.5.2 SI (8-Pin Power SOIC with Exposed Metal Back)
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IXDD609SI Details

  • Manufacturer Part Number:

    IXDD609SI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    9 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.04 µs

  • Turn-on Time:

    0.055 µs

  • Width:

    3.9 mm

IXDD609SI Frequently Asked Questions (FAQs)

  • A good PCB layout for the IXDD609SI should include a solid ground plane, wide traces for power and ground, and a thermal relief pattern under the device to facilitate heat dissipation.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended derating guidelines for the device.
  • The IXDD609SI has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and installation to prevent damage.
  • Yes, the IXDD609SI is suitable for high-frequency switching applications, but ensure that the PCB layout and component selection are optimized for high-frequency operation to minimize losses and ringing.
  • To troubleshoot issues with the IXDD609SI, start by verifying the power supply voltage, checking for proper PCB layout and component selection, and using oscilloscope measurements to identify any anomalies.

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IXDD609SI Overview

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