IXDD630YI footprint, schematic symbol and 3D model by LITTELFUSE

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IXDD630YI Details

The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 20mm x 20mm, and ensuring that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's current rating according to the temperature derating curve provided in the datasheet, and to ensure good airflow around the device to prevent thermal buildup.
The recommended soldering profile for the IXDD630YI involves a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C, and a ramp-up rate of 3°C/second maximum.
Yes, the IXDD630YI is qualified to AEC-Q101 standards, making it suitable for use in high-reliability and automotive applications. However, it is recommended to consult with Littelfuse Inc for specific requirements and testing protocols.
To prevent ESD damage, it is recommended to handle the device with ESD-protective equipment, such as wrist straps and mats, and to follow proper ESD-handling procedures during assembly and testing.

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