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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXDF602SI
- Part Number IXDF602SI
- Manufacturer LITTELFUSE
- Pin Count 8
- Last Modified Date Oct 6, 2025 1:29 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXDF602SI Details
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Manufacturer Part Number:
IXDF602SI
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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HTS Code:
8542.39.00.60
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Manufacturer:
Littelfuse Inc
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YTEOL:
8.1
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High Side Driver:
NO
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Interface IC Type:
BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER
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JESD-30 Code:
R-PDSO-G8
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Length:
4.9 mm
IXDF602SI Frequently Asked Questions (FAQs)
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For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the device and connect it to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and vias away from the thermal pad can reduce thermal resistance.
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To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It is also crucial to ensure good airflow and avoid thermal hotspots.
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The maximum allowed voltage transient for the IXDF602SI is not explicitly stated in the datasheet. However, as a general guideline, it is recommended to limit voltage transients to 10% of the maximum rated voltage to ensure reliable operation and prevent damage to the device.
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Yes, the IXDF602SI can be used in a parallel configuration to increase current handling. However, it is essential to ensure that the devices are properly matched and that the current sharing is balanced to prevent overheating and reduce the risk of thermal runaway.
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The recommended storage temperature range for the IXDF602SI is -40°C to 125°C, and the recommended storage humidity range is 5% to 95% relative humidity. It is essential to follow these guidelines to prevent damage to the device during storage.
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IXDF602SI Overview
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