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IXDN609SITR - LITTELFUSE

Description: Gate Drivers

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IXDN609SITR - LITTELFUSE - PCB symbol
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PCB Footprints
IXDN609SITR - LITTELFUSE PCB footprint - Small Outline Packages - Small Outline Packages - SI (8-Pin Power SOIC with Exposed Metal Back)-
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IXDN609SITR - LITTELFUSE - 3D model - Small Outline Packages - SI (8-Pin Power SOIC with Exposed Metal Back)-
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IXDN609SITR Details

  • Manufacturer Part Number:

    IXDN609SITR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    9 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.04 µs

  • Turn-on Time:

    0.055 µs

  • Width:

    3.9 mm

IXDN609SITR Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXDN609SITR is a standard SOT-23 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a 0.5mm spacing between pads.
  • To ensure reliable operation of IXDN609SITR in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and avoiding excessive power dissipation.
  • Yes, IXDN609SITR is suitable for high-frequency switching applications up to 100 kHz. However, it is recommended to consult the datasheet and application notes for specific guidance on layout, decoupling, and filtering to minimize electromagnetic interference (EMI) and ensure reliable operation.
  • IXDN609SITR has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures when handling the device, such as using an ESD wrist strap, mat, or workstation, and storing the device in an ESD-protected package.
  • Yes, IXDN609SITR is AEC-Q101 qualified, which means it meets the requirements for automotive applications. However, it is recommended to consult the datasheet and application notes for specific guidance on using the device in an automotive environment.

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IXDN609SITR Overview

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