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IXDN614YI - LITTELFUSE

Description: Gate Drivers 14-Ampere Low-Side Ultrafast MOSFET

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IXDN614YI - LITTELFUSE PCB footprint - Other - Other - IXDN614YI-2
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IXDN614YI - LITTELFUSE  - 3D model - Other - IXDN614YI-2
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IXDN614YI Details

  • Manufacturer Part Number:

    IXDN614YI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PSSO-G5

  • Length:

    9.975 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    14 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-263

  • Package Equivalence Code:

    SMSIP5H,.6,67TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.8 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.7 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.075 µs

  • Turn-on Time:

    0.075 µs

  • Width:

    9.15 mm

IXDN614YI Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the device to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are suggested. Refer to the Littelfuse application note AN9313 for more details.
  • Use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the pads and reflow at 240°C to 250°C for 30-60 seconds. Avoid overheating or using excessive solder paste.
  • The maximum allowed voltage on the VIN pin is 28V, but it's recommended to keep it below 24V for optimal performance and reliability.
  • The device is rated for operation up to 125°C, but derating is required above 85°C. Consult the datasheet for thermal derating curves and ensure proper heat sinking and cooling in high-temperature applications.
  • The device has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and storage. Use an ESD wrist strap or mat, and store the devices in anti-static packaging.

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IXDN614YI Overview

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