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IXFA22N65X2 - LITTELFUSE

Description: MOSFET N-CH 650V 22A TO263

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IXFA22N65X2 Details

  • Manufacturer Part Number:

    IXFA22N65X2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.7

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    22 A

  • Drain-source On Resistance-Max:

    0.145 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1.3 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    390 W

  • Pulsed Drain Current-Max (IDM):

    44 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFA22N65X2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXFA22N65X2 is a standard TO-220 package with a minimum pad size of 70 mil x 70 mil and a thermal pad size of 120 mil x 120 mil.
  • Yes, IXFA22N65X2 is suitable for high-frequency switching applications up to 100 kHz due to its low gate charge and fast switching times. However, it's essential to ensure proper gate drive and layout to minimize ringing and EMI.
  • The junction-to-case thermal resistance (RθJC) for IXFA22N65X2 can be calculated using the formula: RθJC = (Tj - Tc) / Pd, where Tj is the junction temperature, Tc is the case temperature, and Pd is the power dissipation. The datasheet provides a thermal resistance value of 1.5°C/W, which can be used as a starting point for calculations.
  • Yes, IXFA22N65X2 is compatible with lead-free soldering processes, including reflow and wave soldering. The device is RoHS compliant and meets the requirements of the European Union's Restriction of Hazardous Substances (RoHS) directive.
  • The recommended gate drive voltage for IXFA22N65X2 is between 10 V and 15 V, with a maximum gate-source voltage of ±20 V. A higher gate drive voltage can improve switching performance, but it's essential to ensure that the gate drive voltage does not exceed the maximum rating.

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IXFA22N65X2 Overview

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