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IXFB300N10P - LITTELFUSE

Description: MOSFET N-CH 100V 300A PLUS264

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IXFB300N10P - LITTELFUSE PCB footprint - Other - Other - IXFB300N10P-1
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IXFB300N10P - LITTELFUSE  - 3D model - Other - IXFB300N10P-1
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IXFB300N10P Details

  • Manufacturer Part Number:

    IXFB300N10P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.3

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    3000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    300 A

  • Drain-source On Resistance-Max:

    0.0055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1500 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFB300N10P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXFB300N10P is a 5-pin TO-220 package with a minimum pad size of 0.2 inches x 0.2 inches and a maximum pad size of 0.3 inches x 0.3 inches.
  • Yes, IXFB300N10P is rated for operation up to 150°C, but derating is required above 125°C. Consult the datasheet for specific derating curves.
  • To ensure reliable operation in high-vibration environments, use a secure mounting method, such as screwing or clipping, and ensure the PCB is properly secured to the chassis or enclosure.
  • Littelfuse recommends using a human-body model (HBM) of ±2kV and a machine model (MM) of ±200V for ESD protection.
  • Yes, but ensure that the devices are properly matched and that the thermal management is adequate to handle the increased power dissipation.

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IXFB300N10P Overview

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