The recommended PCB footprint for the IXFH100N25P is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
Yes, the IXFH100N25P is suitable for high-frequency switching applications up to 100 kHz, but it's essential to consider the device's switching losses, thermal performance, and PCB layout to ensure reliable operation.
To ensure proper cooling, provide a sufficient heat sink with a thermal resistance of ≤ 1°C/W, and ensure good thermal contact between the device and the heat sink. Also, consider the airflow and ambient temperature in your design.
The maximum allowed case temperature for the IXFH100N25P is 150°C, but it's recommended to keep the case temperature below 125°C for reliable operation and to prevent thermal runaway.
Yes, you can parallel multiple IXFH100N25P devices to increase the current rating, but it's essential to ensure that the devices are properly matched, and the PCB layout is designed to minimize current imbalance and thermal differences between the devices.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
IXFH100N25P Overview
Use the download button to access the IXFH100N25P schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IXFH1,
or try a keyword search, such as Power Field-Effect Transistors
