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IXFH10N100P - LITTELFUSE

Description: MOSFET 10 Amps 1000V

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PCB Footprints
IXFH10N100P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 (IXFH)_2021
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3D Models
IXFH10N100P - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247 (IXFH)_2021
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IXFH10N100P Details

  • Manufacturer Part Number:

    IXFH10N100P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1000 V

  • Drain Current-Max (ID):

    10 A

  • Drain-source On Resistance-Max:

    1.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    380 W

  • Pulsed Drain Current-Max (IDM):

    25 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFH10N100P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFH10N100P is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, the IXFH10N100P is rated for operation up to 150°C, but it's recommended to derate the current and voltage ratings according to the temperature derating curve provided in the datasheet.
  • Proper cooling can be achieved by providing a heat sink with a thermal resistance of less than 10°C/W, and ensuring good thermal contact between the device and the heat sink using a thermal interface material.
  • The maximum surge current rating for the IXFH10N100P is 100A for 10ms, but it's recommended to check the surge current derating curve provided in the datasheet for specific application requirements.
  • Yes, the IXFH10N100P can be used in a parallel configuration, but it's recommended to ensure that the devices are matched in terms of voltage and current ratings, and that the current sharing is balanced to prevent overheating.

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IXFH10N100P Overview

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