Part Image

IXFH120N20P - LITTELFUSE

Description: Trans MOSFET N-CH 200V 120A 3-Pin(3+Tab) TO-247AD

Download IXFH120N20P Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
IXFH120N20P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 (IXFH) Outline_2021
click to zoom
3D Models
IXFH120N20P - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247 (IXFH) Outline_2021
click to zoom

IXFH120N20P Details

  • Manufacturer Part Number:

    IXFH120N20P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-247, 3 PIN

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    2000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    120 A

  • Drain-source On Resistance-Max:

    0.022 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    265 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    714 W

  • Pulsed Drain Current-Max (IDM):

    300 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFH120N20P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFH120N20P is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • The IXFH120N20P is rated for operation up to 150°C, but it's recommended to derate the power dissipation at higher temperatures to ensure reliable operation. Consult the datasheet for thermal derating information.
  • Proper cooling can be achieved by using a heat sink with a thermal resistance of 1°C/W or less, and ensuring good thermal contact between the device and the heat sink. A thermal interface material (TIM) can also be used to improve heat transfer.
  • The IXFH120N20P has a maximum surge current rating of 400A for 10ms, but this rating may vary depending on the specific application and operating conditions. Consult the datasheet for more information.
  • Yes, the IXFH120N20P can be used in a parallel configuration, but it's essential to ensure that the devices are properly matched and that the current sharing is balanced to prevent overheating and reduce reliability.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IXFH120N20P Overview

Use the download button to access the IXFH120N20P schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IXFH1, or try a keyword search, such as Power Field-Effect Transistors

Parts related to IXFH120N20P

Showing 0 results