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IXFH12N90P - LITTELFUSE

Description: MOSFET PolarHV HiPerFETs 500V-1.2Kv Red Rds

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PCB Footprints
IXFH12N90P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 (IXFH) Outline_2021
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3D Models
IXFH12N90P - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247 (IXFH) Outline_2021
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IXFH12N90P Details

  • Manufacturer Part Number:

    IXFH12N90P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-247, 3 PIN

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    900 V

  • Drain Current-Max (ID):

    12 A

  • Drain-source On Resistance-Max:

    1 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    33 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    380 W

  • Pulsed Drain Current-Max (IDM):

    24 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFH12N90P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFH12N90P is a TO-220 package with a minimum pad size of 0.2 inches x 0.2 inches and a thermal pad size of 0.4 inches x 0.4 inches.
  • Yes, the IXFH12N90P is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure proper cooling, the IXFH12P90 should be mounted on a heat sink with a thermal resistance of less than 1°C/W. Additionally, the device should be placed in a location with good airflow to help dissipate heat.
  • The maximum allowed case temperature for the IXFH12N90P is 150°C, as specified in the datasheet.
  • Yes, the IXFH12N90P can be used in a parallel configuration to increase current handling, but it is recommended to ensure that the devices are properly matched and that the thermal management is adequate to handle the increased power dissipation.

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IXFH12N90P Overview

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