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IXFH150N17T2 - LITTELFUSE

Description: Trans MOSFET N-CH 175V 150A 3-Pin(3+Tab) TO-247AD

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Symbol
IXFH150N17T2 - LITTELFUSE - PCB symbol
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PCB Footprints
IXFH150N17T2 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IXFH400N075T2
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3D Models
IXFH150N17T2 - LITTELFUSE - 3D model - Transistor Outline, Vertical - IXFH400N075T2
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IXFH150N17T2 Details

  • Manufacturer Part Number:

    IXFH150N17T2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    175 V

  • Drain Current-Max (ID):

    150 A

  • Drain-source On Resistance-Max:

    0.012 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    136 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    880 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFH150N17T2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFH150N17T2 is a TO-220 package with a minimum pad size of 0.2 inches (5 mm) x 0.15 inches (3.8 mm) and a thermal pad size of 0.2 inches (5 mm) x 0.2 inches (5 mm).
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a reflow oven or a soldering iron with a soldering tip to solder the component. Avoid applying excessive heat or pressure, which can damage the component.
  • The maximum operating temperature range for the IXFH150N17T2 is -40°C to 150°C. However, the device's performance and reliability may degrade if operated at temperatures above 125°C for extended periods.
  • The IXFH150N17T2 is a commercial-grade component and may not meet the requirements for high-reliability or aerospace applications. Littelfuse Inc offers other products that are specifically designed and qualified for these applications. Contact Littelfuse Inc for more information.
  • The IXFH150N17T2 is an ESD-sensitive device. Handle the component with ESD-protective equipment, such as wrist straps, mats, and bags. Avoid touching the component's pins or body, and ensure that the component is stored in an ESD-protective package when not in use.

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IXFH150N17T2 Overview

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