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IXFH16N50P - LITTELFUSE

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IXFH16N50P - LITTELFUSE  - 3D model
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IXFH16N50P Details

  • Manufacturer Part Number:

    IXFH16N50P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    750 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    16 A

  • Drain-source On Resistance-Max:

    0.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Pulsed Drain Current-Max (IDM):

    35 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFH16N50P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXFH16N50P is a standard SOT-227 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 4.5mm x 4.5mm.
  • Yes, IXFH16N50P is rated for operation up to 150°C junction temperature, but it's recommended to derate the current and voltage ratings according to the temperature derating curve provided in the datasheet.
  • To ensure reliability, follow proper handling and storage procedures, use a clean and dry PCB assembly process, and perform thorough testing and inspection according to industry standards such as IPC-A-610.
  • Yes, IXFH16N50P can be used in a parallel configuration, but it's essential to ensure that the devices are matched for voltage and current ratings, and that the PCB layout is designed to minimize thermal and electrical mismatch between devices.
  • The recommended gate drive voltage for IXFH16N50P is between 10V and 15V, with a maximum gate-source voltage of ±20V.

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IXFH16N50P Overview

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