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IXFH170N25X3 - LITTELFUSE

Description: DiscMSFT NChUltrJnctn X3Class TO-247AD

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Symbol
IXFH170N25X3 - LITTELFUSE - PCB symbol
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PCB Footprints
IXFH170N25X3 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 height 5.21
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3D Models
IXFH170N25X3 - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-247 height 5.21
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IXFH170N25X3 Details

  • Manufacturer Part Number:

    IXFH170N25X3

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    2300 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    250 V

  • Drain Current-Max (ID):

    170 A

  • Drain-source On Resistance-Max:

    0.0074 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1.6 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    890 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFH170N25X3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFH170N25X3 is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • The IXFH170N25X3 is rated for operation up to 150°C, but it's recommended to derate the power handling at high temperatures. Consult the datasheet for thermal derating curves.
  • Proper cooling can be achieved by using a heat sink with a thermal resistance of less than 1°C/W, and ensuring good airflow around the device. A thermal interface material (TIM) can also be used to improve heat transfer.
  • The IXFH170N25X3 has a maximum surge current rating of 170A for 10ms, but this rating may vary depending on the specific application and operating conditions.
  • Yes, the IXFH170N25X3 can be used in a parallel configuration, but it's essential to ensure that the devices are matched for voltage and current ratings, and that the circuit is designed to handle the increased power handling.

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IXFH170N25X3 Overview

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