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IXFH34N50P3 - LITTELFUSE

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IXFH34N50P3 - LITTELFUSE  - 3D model
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IXFH34N50P3 Details

  • Manufacturer Part Number:

    IXFH34N50P3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    400 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    34 A

  • Drain-source On Resistance-Max:

    0.18 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    7.8 pF

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    695 W

  • Pulsed Drain Current-Max (IDM):

    85 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFH34N50P3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXFH34N50P3 is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, IXFH34N50P3 is rated for operation up to 150°C, but it's recommended to derate the current and voltage ratings according to the temperature derating curve provided in the datasheet.
  • To ensure reliability, follow proper handling and storage procedures, use a clean and dry environment, and avoid exceeding the recommended operating conditions. Additionally, consider using a fuse with a built-in thermal protection device (TPD) or a thermistor to monitor temperature.
  • Yes, IXFH34N50P3 is designed to withstand vibrations up to 10G, but it's recommended to follow proper mounting and soldering procedures to ensure the device remains securely attached to the PCB.
  • Select a fuse value that is greater than the maximum expected current in your application, but less than the maximum current rating of the fuse. Consider factors such as inrush current, steady-state current, and fault current when selecting the fuse value.

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IXFH34N50P3 Overview

Use the download button to access the IXFH34N50P3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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