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IXFH36N50P - LITTELFUSE

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IXFH36N50P - LITTELFUSE  - 3D model
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IXFH36N50P Details

  • Manufacturer Part Number:

    IXFH36N50P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-247, 3 PIN

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    36 A

  • Drain-source On Resistance-Max:

    0.17 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    40 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    540 W

  • Pulsed Drain Current-Max (IDM):

    90 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

IXFH36N50P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFH36N50P is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • The IXFH36N50P is rated for operation up to 150°C, but it's recommended to derate the current and voltage ratings above 125°C to ensure reliable operation.
  • Use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder to the pins. Ensure the pins are clean and free of oxidation before soldering.
  • The IXFH36N50P can withstand surge currents up to 100A for 10ms, but it's recommended to limit the surge current to 50A for 10ms to ensure reliable operation.
  • Yes, but it's recommended to use identical devices and ensure proper thermal management to prevent thermal runaway. Also, consult the datasheet for specific guidelines on paralleling devices.

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IXFH36N50P Overview

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