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IXFH40N30 - LITTELFUSE

Description: MOSFET, N CHANNEL, 300V, 40A, TO-247AD; Transistor Polarity:N Channel; Drain Source Voltage Vds:300V; Continuous Drain Current Id:40A; On Resistance Rds(on):0.085ohm; Transistor Mounting:Through Hole; Rds(on) Test Voltage Vgs:10V RoHS Compliant: Yes

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PCB Footprints
IXFH40N30 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 AD_1
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3D Models
IXFH40N30 - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247 AD_1
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IXFH40N30 Details

  • Manufacturer Part Number:

    IXFH40N30

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    3

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    300 V

  • Drain Current-Max (ID):

    40 A

  • Drain-source On Resistance-Max:

    0.085 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    280 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Pulsed Drain Current-Max (IDM):

    160 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    190 ns

  • Turn-on Time-Max (ton):

    120 ns

IXFH40N30 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXFH40N30 is a standard TO-220 package with a minimum pad size of 70 mils x 70 mils (1.78 mm x 1.78 mm) and a thermal pad size of 100 mils x 100 mils (2.54 mm x 2.54 mm).
  • Yes, IXFH40N30 is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching losses, thermal performance, and layout to ensure reliable operation.
  • To ensure reliability in high-temperature environments, follow proper thermal management practices, such as providing adequate heat sinking, using a thermal interface material, and keeping the junction temperature below 150°C.
  • The recommended gate drive voltage for IXFH40N30 is between 10 V and 15 V. A higher gate drive voltage can reduce switching losses, but it may also increase the risk of gate oxide damage.
  • Yes, you can parallel multiple IXFH40N30 devices to increase current handling. However, it's crucial to ensure that the devices are properly matched, and the gate drive signals are synchronized to prevent uneven current sharing.

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IXFH40N30 Overview

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Part Image IXFH40N30 IXYS Corporation

Power Field-Effect Transistor, 40A I(D), 300V, 0.085ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-247