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IXFH40N30Q - LITTELFUSE

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IXFH40N30Q - LITTELFUSE  - 3D model
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IXFH40N30Q Details

  • Manufacturer Part Number:

    IXFH40N30Q

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    3

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    300 V

  • Drain Current-Max (ID):

    40 A

  • Drain-source On Resistance-Max:

    0.085 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    170 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Pulsed Drain Current-Max (IDM):

    160 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFH40N30Q Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFH40N30Q is a 5-pin TO-220 package with a minimum pad size of 2.5mm x 2.5mm and a maximum pad size of 5mm x 5mm, with a 1.5mm hole for the heatsink.
  • The IXFH40N30Q is rated for operation up to 150°C, but it's recommended to derate the device's current and voltage ratings above 125°C to ensure reliable operation. Consult the datasheet for specific derating guidelines.
  • Proper cooling is crucial for the IXFH40N30Q. Ensure good thermal contact between the device and the heatsink, and use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. The recommended heatsink size is at least 20mm x 20mm x 10mm.
  • The IXFH40N30Q can handle surge currents up to 400A for 10ms, but it's recommended to limit surge currents to 200A for 10ms to ensure reliable operation.
  • Yes, the IXFH40N30Q can be used in a parallel configuration, but it's essential to ensure that the devices are matched in terms of voltage and current ratings, and that the PCB layout is designed to minimize current imbalance and thermal mismatch.

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IXFH40N30Q Overview

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