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- Stock & Prices $ Price & Stock for IXFH50N60P3
- Part Number IXFH50N60P3
- Manufacturer LITTELFUSE
- Pin Count 3
- Part Category MOSFET (N-Channel)
- Last Modified Date Jun 14, 2023 12:53 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXFH50N60P3 Details
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Manufacturer Part Number:
IXFH50N60P3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Philippines
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ECCN Code:
EAR99
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Manufacturer:
Littelfuse Inc
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YTEOL:
6
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Additional Feature:
AVALANCHE RATED
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Avalanche Energy Rating (Eas):
1000 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
IXFH50N60P3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the IXFH50N60P3 is a TO-220 package with a minimum pad size of 4.5mm x 4.5mm and a thermal pad size of 2.5mm x 2.5mm. It's essential to follow the recommended footprint to ensure proper heat dissipation and electrical connection.
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While the IXFH50N60P3 is a fast-switching IGBT, it's not recommended for high-frequency switching applications above 100 kHz. The device is optimized for switching frequencies up to 50 kHz. For higher frequencies, consider using a dedicated high-frequency IGBT or a MOSFET.
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To ensure proper cooling, provide a heat sink with a thermal resistance of ≤ 1°C/W and a minimum surface area of 20mm x 20mm. Apply a thermal interface material (TIM) with a thermal conductivity of ≥ 1 W/m-K between the device and the heat sink. Ensure good airflow around the heat sink and avoid blocking the airflow path.
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The maximum allowed voltage transient for the IXFH50N60P3 is ± 10% of the rated voltage (600V) for a duration of ≤ 100ms. Exceeding this limit may damage the device or affect its reliability.
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Yes, you can use multiple IXFH50N60P3 devices in parallel to increase current handling. However, ensure that each device has its own gate resistor and that the gate signals are properly synchronized to avoid shoot-through currents. Also, consider the thermal management and PCB layout to ensure even current distribution.
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IXFH50N60P3 Overview
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