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IXFK140N20P - LITTELFUSE

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IXFK140N20P - LITTELFUSE  - 3D model
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IXFK140N20P Details

  • Manufacturer Part Number:

    IXFK140N20P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.92

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    4000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    140 A

  • Drain-source On Resistance-Max:

    0.018 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    280 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFK140N20P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFK140N20P is a standard TO-220 package with a minimum pad size of 70 mils x 70 mils. It's recommended to follow the PCB layout guidelines provided in the datasheet or in Littelfuse's application notes.
  • The IXFK140N20P is a commercial-grade device, but Littelfuse offers a high-reliability version, the IXFK140N20P-HR, which is designed for high-reliability and aerospace applications. The high-reliability version has undergone additional screening and testing to ensure its performance in harsh environments.
  • To ensure proper cooling, it's recommended to provide a heat sink with a thermal resistance of less than 1°C/W. The heat sink should be attached to the device using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. Additionally, ensure good airflow around the device and follow the thermal design guidelines provided in the datasheet.
  • Yes, you can parallel multiple IXFK140N20P devices to increase current handling, but it's essential to ensure that the devices are properly matched and that the current sharing is balanced. Littelfuse recommends following their application notes and consulting with their technical support team to ensure proper paralleling of the devices.
  • The recommended gate drive voltage for the IXFK140N20P is between 10V and 15V. However, the device can tolerate gate drive voltages up to 20V. It's essential to ensure that the gate drive voltage is within the recommended range to prevent damage to the device.

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IXFK140N20P Overview

Use the download button to access the IXFK140N20P 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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