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IXFK140N30P - LITTELFUSE

Description: MOSFET 140 Amps 300V 0.024 Ohms Rds

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PCB Footprints
IXFK140N30P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-264 (IXTK)
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3D Models
IXFK140N30P - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-264 (IXTK)
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IXFK140N30P Details

  • Manufacturer Part Number:

    IXFK140N30P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.22

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    5000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    300 V

  • Drain Current-Max (ID):

    140 A

  • Drain-source On Resistance-Max:

    0.024 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1040 W

  • Pulsed Drain Current-Max (IDM):

    300 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFK140N30P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFK140N30P is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, the IXFK140N30P is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure proper cooling, the IXFK140N30P should be mounted on a heat sink with a thermal resistance of less than 1°C/W, and the heat sink should be designed to provide adequate airflow.
  • The maximum allowed case temperature for the IXFK140N30P is 150°C, and the device should be operated at a case temperature below 125°C for optimal performance and reliability.
  • Yes, the IXFK140N30P can be used in a parallel configuration to increase the current handling capability, but it is recommended to use a current sharing scheme to ensure equal current distribution between devices.

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IXFK140N30P Overview

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