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IXFK150N30P3 - LITTELFUSE

Description: N-Ch 300V 150A 1300W 0,019R TO264AA

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PCB Footprints
IXFK150N30P3 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-264-ren2
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3D Models
IXFK150N30P3 - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-264-ren2
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IXFK150N30P3 Details

  • Manufacturer Part Number:

    IXFK150N30P3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.22

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    4000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    300 V

  • Drain Current-Max (ID):

    150 A

  • Drain-source On Resistance-Max:

    0.019 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    40 pF

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1300 W

  • Pulsed Drain Current-Max (IDM):

    375 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFK150N30P3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFK150N30P3 is a standard TO-247 package with a minimum pad size of 6.5mm x 5.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux to the pins. Avoid applying excessive force or pressure to the pins during soldering.
  • The maximum allowed junction temperature for the IXFK150N30P3 is 150°C. Exceeding this temperature can lead to reduced performance, reliability, and lifespan of the device.
  • Yes, the IXFK150N30P3 is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching losses, thermal performance, and layout parasitics to ensure reliable operation.
  • To protect the IXFK150N30P3 from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB and components are properly grounded. Avoid touching the pins or exposed metal surfaces during handling.

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IXFK150N30P3 Overview

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