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IXFK150N30X3 - LITTELFUSE

Description: Trans MOSFET N-CH 300V 150A 3-Pin(3+Tab) TO-264

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Symbol
IXFK150N30X3 - LITTELFUSE - PCB symbol
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PCB Footprints
IXFK150N30X3 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-264K
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3D Models
IXFK150N30X3 - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-264K
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IXFK150N30X3 Details

  • Manufacturer Part Number:

    IXFK150N30X3

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.17

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    2000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    300 V

  • Drain Current-Max (ID):

    150 A

  • Drain-source On Resistance-Max:

    0.0083 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1.7 pF

  • JESD-30 Code:

    R-PSIP-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    890 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFK150N30X3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFK150N30X3 is a TO-247-3L package with a minimum pad size of 6.5mm x 5.5mm and a thermal pad size of 10mm x 10mm.
  • Yes, the IXFK150N30X3 is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure proper cooling, the IXFK150N30X3 should be mounted on a heat sink with a thermal resistance of less than 1°C/W, and the heat sink should be designed to dissipate the maximum power dissipation of the device.
  • The maximum allowed case temperature for the IXFK150N30X3 is 150°C, and the device should be operated at a case temperature below this value to ensure reliable operation.
  • Yes, the IXFK150N30X3 can be used in a parallel configuration to increase the current handling capability, but it is recommended to use a current sharing scheme to ensure equal current distribution among the devices.

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IXFK150N30X3 Overview

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