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IXFK230N20T - LITTELFUSE

Description: MOSFET 230A 200V

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PCB Footprints
IXFK230N20T - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-264 (IXFK)_1
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3D Models
IXFK230N20T - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-264 (IXFK)_1
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IXFK230N20T Details

  • Manufacturer Part Number:

    IXFK230N20T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    5000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    230 A

  • Drain-source On Resistance-Max:

    0.0075 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    60 pF

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1670 W

  • Pulsed Drain Current-Max (IDM):

    630 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFK230N20T Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFK230N20T is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, the IXFK230N20T is designed for high-reliability applications and meets the requirements of AEC-Q101, a standard for automotive-grade components.
  • To ensure proper cooling, the IXFK230N20T should be mounted on a heat sink with a thermal resistance of ≤ 1°C/W, and the heat sink should be designed to dissipate the maximum power dissipation of the device (150W).
  • The maximum allowed case temperature for the IXFK230N20T is 150°C, and the maximum junction temperature is 175°C.
  • Yes, the IXFK230N20T can be used in a parallel configuration to increase current handling, but it is recommended to use a current sharing scheme to ensure equal current distribution among the devices.

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IXFK230N20T Overview

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