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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXFK26N100P
- Part Number IXFK26N100P
- Manufacturer LITTELFUSE
- Last Modified Date Aug 2, 2021 10:22 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXFK26N100P Details
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Manufacturer Part Number:
IXFK26N100P
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Manufacturer:
Littelfuse Inc
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YTEOL:
6
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Additional Feature:
AVALANCHE RATED
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Avalanche Energy Rating (Eas):
1000 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
1000 V
IXFK26N100P Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the IXFK26N100P is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
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Yes, the IXFK26N100P is suitable for high-frequency switching applications up to 100 kHz, but it's essential to consider the device's switching losses, thermal management, and PCB layout to ensure reliable operation.
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To ensure proper cooling, provide a heat sink with a thermal resistance of ≤ 1°C/W, and apply a thermal interface material (TIM) with a thermal conductivity of ≥ 1 W/m-K. Also, ensure good airflow around the device and heat sink.
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The maximum allowed case temperature for the IXFK26N100P is 150°C, but it's recommended to operate the device at a case temperature below 125°C to ensure reliable operation and long lifespan.
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Yes, you can parallel multiple IXFK26N100P devices to increase current handling, but it's crucial to ensure that each device has an identical thermal environment and is properly matched to prevent current imbalance and thermal runaway.
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IXFK26N100P Overview
Use the download button to access the IXFK26N100P 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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