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IXFK90N20Q - LITTELFUSE

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IXFK90N20Q - LITTELFUSE  - 3D model
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IXFK90N20Q Details

  • Manufacturer Part Number:

    IXFK90N20Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    3

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    2500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    90 A

  • Drain-source On Resistance-Max:

    0.022 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    500 W

  • Pulsed Drain Current-Max (IDM):

    360 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFK90N20Q Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFK90N20Q is a TO-220 package with a minimum pad size of 0.2 inches (5 mm) x 0.15 inches (3.8 mm) and a thermal pad size of 0.2 inches (5 mm) x 0.2 inches (5 mm).
  • Yes, the IXFK90N20Q is designed for high-reliability applications and meets the requirements of AEC-Q101, a standard for automotive-grade components. However, it's essential to follow proper design, testing, and validation procedures to ensure the device meets the specific requirements of your application.
  • To ensure proper cooling, provide a sufficient heat sink with a thermal resistance of less than 1°C/W, and ensure good thermal contact between the device and the heat sink. Additionally, consider the airflow and ambient temperature in your design to prevent overheating.
  • The maximum allowed case temperature for the IXFK90N20Q is 150°C. Operating the device above this temperature can reduce its lifespan and affect its performance.
  • Yes, the IXFK90N20Q can be used in a parallel configuration to increase current handling. However, it's essential to ensure that the devices are properly matched, and the circuit is designed to handle the increased current and thermal requirements.

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IXFK90N20Q Overview

Use the download button to access the IXFK90N20Q 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like IXFK9, or try a keyword search, such as Power Field-Effect Transistors

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