Please enter a minimum 3 letters or numbers
Technical Content
Part Image

IXFL100N50P - LITTELFUSE

Description: IXYS SEMICONDUCTOR - IXFL100N50P - MOSFET, N, 500V, 70A, ISOPLUS264

Download IXFL100N50P Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
IXFL100N50P - LITTELFUSE - PCB symbol
click to zoom
PCB Footprints
IXFL100N50P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - ISOPLUS264 (IXFL)
click to zoom
3D Models
IXFL100N50P - LITTELFUSE - 3D model - Transistor Outline, Vertical - ISOPLUS264 (IXFL)
click to zoom

IXFL100N50P Details

  • Manufacturer Part Number:

    IXFL100N50P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.18

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    5000 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    70 A

  • Drain-source On Resistance-Max:

    0.052 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    250 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFL100N50P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFL100N50P is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • The IXFL100N50P is rated for operation up to 150°C, but it's recommended to derate the current handling capability by 20% for every 10°C above 100°C to ensure reliable operation.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Avoid applying excessive force or heat, which can damage the device.
  • Store the IXFL100N50P in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
  • The IXFL100N50P is designed to withstand moderate vibration, but it's recommended to secure the device to the PCB using a suitable mounting method, such as a screw or adhesive, to prevent damage or dislodging.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IXFL100N50P Overview

Use the download button to access the IXFL100N50P schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IXFL1, or try a keyword search, such as Power Field-Effect Transistors

Parts related to IXFL100N50P

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑