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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXFN180N20
- Part Number IXFN180N20
- Manufacturer LITTELFUSE
- Last Modified Date Aug 2, 2021 10:22 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXFN180N20 Details
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Manufacturer Part Number:
IXFN180N20
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Part Life Cycle Code:
Not Recommended
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ECCN Code:
EAR99
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Manufacturer:
Littelfuse Inc
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YTEOL:
3
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Additional Feature:
AVALANCHE RATED
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Avalanche Energy Rating (Eas):
4000 mJ
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Case Connection:
ISOLATED
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
200 V
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Drain Current-Max (ID):
180 A
IXFN180N20 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for IXFN180N20 is a standard TO-220 package with a minimum pad size of 70 mils x 70 mils and a thermal pad size of 100 mils x 100 mils.
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Yes, IXFN180N20 is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching losses, thermal performance, and layout to ensure reliable operation.
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The junction-to-case thermal resistance (RθJC) for IXFN180N20 can be calculated using the formula: RθJC = (TJ - TC) / P, where TJ is the junction temperature, TC is the case temperature, and P is the power dissipation. The datasheet provides a typical value of RθJC as 1.5°C/W.
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Yes, IXFN180N20 is compatible with lead-free soldering processes, such as SnAgCu (SAC) and SnCu, with a peak reflow temperature of 260°C.
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The recommended gate drive voltage for IXFN180N20 is between 10 V and 15 V, with a maximum gate-source voltage of ±20 V.
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IXFN180N20 Overview
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