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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXFP16N50P
- Part Number IXFP16N50P
- Manufacturer LITTELFUSE
- Last Modified Date Aug 2, 2021 10:22 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXFP16N50P Details
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Manufacturer Part Number:
IXFP16N50P
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Manufacturer:
Littelfuse Inc
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YTEOL:
5.95
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Additional Feature:
AVALANCHE RATED
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Avalanche Energy Rating (Eas):
750 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
500 V
IXFP16N50P Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the IXFP16N50P is a standard SOT-227 package footprint, with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 4.5mm x 4.5mm.
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Yes, the IXFP16N50P is suitable for high-frequency switching applications up to 100 kHz, but it's essential to consider the device's switching losses, thermal performance, and PCB layout to ensure reliable operation.
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To ensure proper cooling, provide a sufficient heat sink, use thermal interface material (TIM) between the device and heat sink, and maintain a minimum air gap of 1mm between the device and any surrounding components.
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The maximum allowed case temperature for the IXFP16N50P is 150°C, but it's recommended to operate the device at a case temperature below 125°C to ensure reliable operation and long-term reliability.
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Yes, the IXFP16N50P can be used in a parallel configuration to increase current handling, but it's essential to ensure that the devices are properly matched, and the PCB layout is designed to minimize current imbalance and thermal gradients.
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IXFP16N50P Overview
Use the download button to access the IXFP16N50P 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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